CVE-2025-47364
Integer Overflow or Wraparound in Automotive
- Published
- Last modified
- Where the record stands: published, rejected by its publisher, or superseded by another id.What do these mean? →
- published
- Whether CISA lists it in its Known Exploited Vulnerabilities catalog: proof that attackers are using it.What do these mean? →
- Not listed in CISA KEV
- Whether working attack code is public (Exploit-DB, Metasploit, Nuclei or GitHub). Public code makes attacks easier.What do these mean? →
- None on Exploit-DB, Metasploit or GitHub
CISA's decision points: whether it is exploited, whether attacks can be automated, and how much control an attacker gets. Assessed (SSVC 2.0.3).What do these mean? →
- Exploitation: none
- Automatable: no
- Technical impact: total
Summary
Memory corruption while calculating offset from partition start point.
Timeline
- CVE published
- CISA SSVC assessment
Exploitation: none · Automatable: no · Technical impact: total
- Record last updated
Affected versions
- Qualcomm, Inc. Snapdragon
QAM8255P, QAM8295P, QAM8620P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6574AU, QCA6595, QCA6595AU, QCA6688AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8695AU, SA6145P, SA6150P, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8650P, SA8770P, and 5 more