CVE-2020-11239
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snap
- Published
- Last modified
- Where the record stands: published, rejected by its publisher, or superseded by another id.What do these mean? →
- published
- Whether CISA lists it in its Known Exploited Vulnerabilities catalog: proof that attackers are using it.What do these mean? →
- Not listed in CISA KEV
- Whether working attack code is public (Exploit-DB, Metasploit, Nuclei or GitHub). Public code makes attacks easier.What do these mean? →
- None on Exploit-DB, Metasploit or GitHub
Summary
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Timeline
- CVE published
- Record last updated
Affected versions
- Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Version range not reported