CVE-2019-10558
While transferring data from APPS to DSP, Out of bound in FastRPC HLOS Driver due to the data buffer which can be controlled by DSP in Snapd
- Published
- Last modified
- Where the record stands: published, rejected by its publisher, or superseded by another id.What do these mean? →
- published
- Whether CISA lists it in its Known Exploited Vulnerabilities catalog: proof that attackers are using it.What do these mean? →
- Not listed in CISA KEV
- Whether working attack code is public (Exploit-DB, Metasploit, Nuclei or GitHub). Public code makes attacks easier.What do these mean? →
- None on Exploit-DB, Metasploit or GitHub
Summary
While transferring data from APPS to DSP, Out of bound in FastRPC HLOS Driver due to the data buffer which can be controlled by DSP in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCN7605, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM845, SDX20, SDX24, SDX55, SM6150, SM8150, SM8250, SXR1130, SXR2130
Timeline
- CVE published
- Record last updated
Affected versions
- Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Version range not reported