Skip to main content
← All vulnerabilities
CVE-2017-18323

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions

Published
Last modified
published
Not listed in CISA KEV
None on Exploit-DB, Metasploit or GitHub

Summary

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

Timeline

  1. CVE published
  2. Record last updated

Affected versions

  • Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

    Version range not reported

References 2

qualcomm.com

securityfocus.com