CVE-2017-18157
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM
- Published
- Last modified
- Where the record stands: published, rejected by its publisher, or superseded by another id.What do these mean? →
- published
- Whether CISA lists it in its Known Exploited Vulnerabilities catalog: proof that attackers are using it.What do these mean? →
- Not listed in CISA KEV
- Whether working attack code is public (Exploit-DB, Metasploit, Nuclei or GitHub). Public code makes attacks easier.What do these mean? →
- None on Exploit-DB, Metasploit or GitHub
Summary
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Timeline
- CVE published
- Record last updated
Affected versions
- Qualcomm Technologies, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20